PCN-TOPAZ-G

Number: PCN-TOPAZ-G

Issue Date: 3 May 2019

Implementation Date: May 2019

Samples: email support@devicesolutions.net 

Description: 

This revision incorporates 2 changes:

  1. Change in the NAND Flash part
  2. Increased capacitor values for the i.MX25 PLL power rails

Reason for change: 

  1. The Micron NAND used originally has been discontinued.  Two new parts have been qualified for use in this revision.
  2. An intermittent situation where the PLL did not start correctly was identified on ~15% of production units. These units would fail to boot ~2% of the time. 


Customer action required: Software update 

The new NAND parts are identical except for their manufacturer ID.  This ID is checked by the software, so an update is required to account for the new parts.

Updates are required for Windows CE (eboot.bin and nk.bin) and TopazFlasher.

The changes can be made NOW, and used on existing -F Topaz modules.


Windows CE

Download a new version of fmd.cpp here, and replace the file in your Windows CE build tree.  

PLATFORM\COMMON\SRC\SOC\COMMON_TOPAZ_V1\NAND\FMDCOMMON\BIG_SECTOR_INTERLEAVE\fmd.cpp

Rebuild your OS and use the new eboot.bin and nk.bin files.

The change masks the manufacturer ID allowing a device reporting a type of 0xA1 to be accepted.  


TopazFlasher

Download the latest version from GuruCE.com


Contact support@devicesolutions.net for any further information.