This page has some general guidelines and thing to watch out for when taking a new board with the LGA package into production.  We provide examples below, but most of the information will depend on your board and the types and density of components you have on it.

Soldering recommendations

• Paste with no-clean flux. (need to keep flux gases low due to LGA pads or voiding beyond IPC limits will occur.)
• The pad shape can be 1:1 with the LGA pad shape, or 0.9mm circles. Do not use a shape larger than the LGA pad.
• Stencil thickness will depend on other components on your baseboard and how much solder they need.
• 5 Thou stencil gives good balance between LGA (large paste volume) and 0402’s (small volume). It is important to remember this and not bias to one extreme or the other. Designs for 0402 and ultra-fine pitch will not leave enough paste volume for LGA pads.

 Profile

We recommend manufacturers profile a board with their line to ensure all parts reach the required temperature.

An example profile used by a board with the Topaz LGA module is:

• Peak temp between 235 and 245
• Liquidius no more than 80 Sec no less than 40
• Ramp no faster than 4deg/s