Other variants are available on request and are subject to minimum order quantities.
The generic part number for Topaz is: Topaz - PP - 25X - RRR - FFF – T – V - C
PP
Module package
LGA: Surface mount SD: SO-DIMM Blank: LGA/Surface mount (legacy part#)
X
i.MX25 CPU variant
1: i.MX251 (Automotive - no LCD) 5: i.MX255 (Automotive - all features) 3: i.MX253 (Industrial - no touch or CAN) 7: i.MX257 (Industrial - no security) 8: i.MX258 (Industrial - all features)
RRR
RAM
064: 64MBytes 128: 128MBytes
FFF
NAND Flash size
128: 128MBytes 256: 256MBytes 512: 512MBytes
T
Temperature rating
I:- -20 to 85C C: 0 to 70C
V
Version
Blank: RevC D: Revision D (LGA only) E: Revision E (SO-DIMM only) F: Revision F (LGA and SO-DIMM) - PCN G: Latest revision (LGA and SO-DIMM) - PCN
C
Customer number
Indicates customer specific software and MAC address information loaded during production. This is blank for standard parts.
Packaging and Standard Order Quantities
Topaz LGA
Topaz SO-DIMM
Packaging
JEDEC BGA tray
Custom tray
Standard Pack Quantity
20pcs
50pcs
Samples
Single unit in anti-static bag. Baking is required before use
Single unit in anti-static bag
Customer Software and MAC address Programming
Topaz modules are delivered with a test version of the Windows CE boot-loader programmed. This must be re-programmed during your final production process. For customers using Windows CE, Topaz modules can be delivered with your software and MAC address programmed. Additional charges for setup and a minimum order quantity of 100pcs applies for this service.
Revision History
LGA
Revision
Changes
D
Ground pads reduce in size to be the same as all other pads. Solder added to bottom pads.
SO-DIMM
Revision
Changes
D
Initial version.
E
Mounting holes reduce from 3mm to 2.7mm diameter and changed from un-plated to plated.