Number: PCN-TOPAZ-G
Issue Date: 18 March 3 May 2019
Implementation Date: April May 2019
Samples: email support@devicesolutions.net
Description: NAND Flash parts are now in use:
This revision incorporates 2 changes:
- Change in the NAND Flash part
- Increased capacitor values for the i.MX25 PLL power rails
Reason for change: The
- The Micron NAND used originally has been discontinued
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- . Two new parts have been qualified for use in this revision.
- An intermittent situation where the PLL did not start correctly was identified on ~15% of production units. These units would fail to boot ~2% of the time.
Customer action required: Software update
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Download a new version of fmd.cpp here, and replace the file in your Windows CE build tree. Rebuild your OS and use the new eboot.bin and nk.bin files.
PLATFORM\COMMON\SRC\SOC\COMMON_TOPAZ_V1\NAND\FMDCOMMON\BIG_SECTOR_INTERLEAVE\fmd.cpp
Rebuild your OS and use the new eboot.bin and nk.bin files.
The change masks the manufacturer ID allowing and a device reporting a type of 0xA1 to be accepted.
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